Electronic assembly and method of manufacturing same

ABSTRACT

An electronic assembly comprises a housing, a cover for the housing, a printed circuit board receivable in the housing, and a compliant pin header assembly. The compliant pin header assembly is mountable in the housing by inter-engaging features on the header assembly and the housing. The compliant pin header assembly has compliant pins for engaging corresponding features on the printed circuit board to connect the compliant pin header assembly electrically to the printed circuit board. The cover, when the electronic assembly is assembled, engages the housing and also engages the printed circuit board at a location spaced from an outer periphery of the printed circuit board.

RELATED APPLICATIONS

This application claims priority from U.S. Provisional Application No.61/008,393, filed Dec. 20, 2007.

TECHNICAL FIELD

The present invention relates to an electronic assembly and a method ofmanufacturing the electronic assembly and, more particularly, to anelectronic assembly that includes a printed circuit board and a methodof manufacturing such an electronic assembly.

BACKGROUND OF THE INVENTION

It is known to provide an enclosure for an electronic assembly thatincludes a printed circuit board and a connector. For example,electronic modules and sensors for automotive applications often includea multi-piece (e.g., housing and cover) enclosure for their electroniccomponents, together with a connector that is mounted on a printedcircuit board (“PCB”). Because the connector is mounted on the PCB,difficulties may arise in achieving desired alignment between theconnector for the electronic assembly and an external, mating connector,which together electrically connect the electronic assembly to otherportions of the vehicle circuitry.

An alternative approach is to use an electronic assembly that includes aplastic enclosure with insert molded connector terminals. Such anenclosure with insert molded connector terminals is expensive as itrequires unique tooling and assembly equipment for each particularvehicle application.

SUMMARY OF THE INVENTION

The present invention is directed to an electronic assembly and a methodof manufacturing the electronic assembly and, more particularly, to anelectronic assembly that includes a printed circuit board and a methodof manufacturing such an electronic assembly.

In accordance with one example embodiment of the present invention, anelectronic assembly comprises a housing, a cover for the housing, aprinted circuit board receivable in the housing, and a compliant pinheader assembly. The compliant pin header assembly is mountable in thehousing by inter-engaging features on the header assembly and thehousing. The compliant pin header assembly has compliant pins forengaging corresponding features on the printed circuit board to connectthe compliant pin header assembly electrically to the printed circuitboard. When assembled, the cover engages the housing and also engagesthe printed circuit board at a location spaced from an outer peripheryof the printed circuit board.

In accordance with another example embodiment of the present invention,an electronic assembly comprises a housing, a printed circuit boardreceivable in the housing, and a compliant pin header assembly. Thecompliant pin header assembly includes (a) a header with passages formedto receive compliant pins and (b) electrically conductive compliant pinsreceivable in the passages of the header. The compliant pin headerassembly is mountable in the housing with the compliant pins engageablewith and electrically connectable to the printed circuit board. Eachpassage of the header is at least partially defined by a substantiallyflat datum surface and an opposed passage surface. Each compliant pin isreceivable in a corresponding one of said passages and has asubstantially flat pin surface for engaging the datum surface of thecorresponding passage and also has an opposed pin surface. The opposedpin surface includes a raised portion for engaging the opposed passagesurface of the corresponding passage and thereby pressing thesubstantially flat pin surface of the compliant pin against the datumsurface of the corresponding passage when said compliant pin is receivedin the corresponding passage.

In accordance with a further example embodiment of the presentinvention, an enclosure for a printed circuit board comprises a housingwith at least one projection formed on an interior surface of thehousing to engage and support the printed circuit board. The at leastone projection has a flat surface for receiving and supporting theprinted circuit board and an adjacent angled surface. The angled surfacehelps to position the printed circuit board on the flat surface.

In accordance with still a further example embodiment of the presentinvention, a method is provided for assembling an electronic device. Themethod comprises the steps of inserting a compliant pin into a header toform a compliant pin header assembly and engaging the compliant pinheader assembly with a housing so that a first end of the compliant pinis presented outwardly of the housing and a second end of the compliantpin is disposed within the housing. The method also comprises the stepsof placing a printed circuit board within the housing so that theprinted circuit board engages the second end of the compliant pin andplacing a cover on the housing so that the cover engages the housing andalso engages the printed circuit board at a location spaced from anouter periphery of the printed circuit board.

In accordance with yet a further example embodiment of the presentinvention, a method is provided for assembling an electronic device. Themethod comprises the step of molding a header from a plastic headermaterial to form passages in the header to receive a plurality ofcompliant pins. Each passage of the header is at least partially definedby a substantially flat datum surface and an opposed passage surface.The method also comprises the step of forming each of the compliant pinsfrom electrically conductive material to have a substantially flat pinsurface and an opposed pin surface that includes a raised portion. Themethod further comprises the step of inserting each compliant pin into acorresponding passage of the header to form a compliant pin headerassembly. The raised portion of the opposed pin surface of the compliantpin engages the opposed passage surface of the corresponding passage andthereby presses the substantially flat pin surface of the compliant pinagainst the datum surface of the corresponding passage. The method stillfurther comprises the steps of engaging the compliant pin headerassembly with a housing so that a first end of each compliant pin ispresented outwardly of the housing and a second end of each compliantpin is disposed within the housing and placing a printed circuit boardwithin the housing so that the printed circuit board engages the secondend of each compliant pin.

In accordance with still a further example embodiment of the presentinvention, a method is provided for manufacturing different electronicdevices using common equipment. The method comprises the step of forminga first compliant pin header assembly that includes a first header and afirst plurality of compliant pins. The method also comprises the step ofengaging the first compliant pin header assembly with a first housingusing a common header-to-housing assembly machine so that a first end ofeach compliant pin of the first plurality of compliant pins is presentedoutwardly of the first housing and a second end of each compliant pin ofthe first plurality of compliant pins is disposed within the firsthousing. The method further comprises the step of placing a firstprinted circuit board within the first housing using a commonboard-to-housing assembly machine so that the first printed circuitboard engages the second end of each compliant pin of the firstplurality of compliant pins. The method yet further comprises the stepof forming a second compliant pin header assembly that includes a secondheader and a second plurality of compliant pins. The method stillfurther comprises the step of engaging the second compliant pin headerassembly with a second housing using the common header-to-housingassembly machine so that a first end of each compliant pin of the secondplurality of compliant pins is presented outwardly of the second housingand a second end of each compliant pin of the second plurality ofcompliant pins is disposed within the second housing. The second housinghas a different housing characteristic than the first housing. Themethod further yet comprises the step of placing a second printedcircuit board within the second housing using the commonboard-to-housing assembly machine so that the second printed circuitboard engages the second end of each compliant pin of the secondplurality of compliant pins. The second printed circuit board has adifferent circuit board characteristic than the first printed circuitboard.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and advantages of the present inventionwill become apparent to those skilled in the art to which the presentinvention relates upon reading the following description with referenceto the accompanying drawings, in which:

FIG. 1 is an exploded perspective view of a first example embodiment ofan electronic assembly constructed in accordance with the presentinvention;

FIG. 2 is a perspective view of the electronic assembly of FIG. 1;

FIG. 3 is a sectional view taken along line 3-3 of FIG. 2;

FIG. 4A is an exploded view of a header assembly for use with theelectronic assembly of FIG. 1;

FIG. 4B is a downward looking perspective view, partially exploded, ofan alternate construction of the header assembly of FIG. 4A;

FIG. 5A is top view of a header assembly being assembled in a housingfor the electronic assembly of FIG. 1;

FIG. 5B is side view of a header assembly in a housing for theelectronic assembly of FIG. 1;

FIGS. 6A and 6B are enlarged views of portions of the header assembly ofFIG. 4A installed in the housing of FIG. 5A;

FIGS. 7A, 7B and 7C are enlarged views of portions of the headerassembly of FIGS. 4A and 4B;

FIGS. 8A and 8B are enlarged views of portions of the housing of FIG.5A;

FIG. 9A is an enlarged top perspective view of a capacitor carrierinstalled in the housing of the electronic assembly of FIG. 1;

FIGS. 9B is an enlarged bottom perspective view, of the capacitorcarrier of FIG. 9A; and

FIG. 10 is a schematic illustration of the method steps in accordancewith one example process for manufacturing an electronic assembly inaccordance with the present invention.

DETAILED DESCRIPTION

Referring to FIGS. 1 through 3, an electronic assembly 10 in accordancewith an example embodiment of the present invention is shown. Theelectronic assembly 10 includes a plastic housing 12. The plastichousing 12 is a one-piece molded unit with four housing side walls 14a-14 d and a top 16 and may be lighter in weight than a comparably sizedmetal housing. The plastic housing 12 receives a printed circuit board(“PCB”) 18 and a separate compliant pin header assembly 20. Thecompliant pin header assembly 20 is snapped in place in the housing. ThePCB 18 is pressed onto the compliant pin header assembly 20, as will bedescribed in greater detail below. The compliant pin header assembly 20includes a compliant pin header 22 and two rows of compliant pins orterminals 24. The compliant pin header 22 is a molded plastic part, andthe compliant pins or terminals 24 may be “stitched into” the pinheader, rather than being insert molded in the pin header. A portion ofthe compliant pin header assembly 20 is exposed to the exterior of thehousing 12 and may be engaged by a mating harness connector (not shown),which is connected to circuitry in a vehicle (not shown) or to otherexternal circuitry. A metal cover 26 without a conformal coating closesthe open bottom of the housing 12. An O-ring seal 28 may be providedbetween the cover 26 and the housing 12 to help seal the electronicassembly 10.

The metal cover 26 is secured to the housing 12 by metal screws 30 thatextend through openings 32 formed in depressions 34 in the cover. Themetal screws 30 also extend through openings 36 in the PCB 18. Posts 38,which extend away from the top 16 of the housing 12 toward the metalcover 26, are aligned with the openings 32 and 36. Metal inserts 44 withthreaded central openings are mounted, via a press fit, for example, inthe ends of the posts 38 adjacent the PCB 18. The threaded ends of themetal screws 30 are screwed into the threaded central openings in themetal inserts 44 to help secure the metal cover 26 to the plastichousing 12. The screws 30 and the metal inserts 44 also help to hold thePCB 18 in the housing 12 both by having the cover clamped against thePCB and by the engagement between the screws and the metal inserts.

A ground connection to the body of a vehicle (not shown) may be providedthrough the metal cover 26 by the metal screws 30 and the threaded metalinserts 44. Specifically, when the metal screws 30 are screwed into andtightened in the threaded metal inserts 44, the inserts may engageelectrically-conductive portions (not shown) of the PCB 18. Thisprovides a ground path from the electrically-conductive portions of thePCB 18 through the threaded metal inserts 44 and the metal screws 30 tothe metal cover 26. As will be explained below, the metal cover 26 may,in turn, be grounded to the vehicle body (not shown).

To help mount the electronic assembly 10 to the vehicle body (notshown), the metal cover 26 includes three lugs or ears 46. The lugs 46are formed in one piece with remainder of the metal cover 26 and projectlaterally outward at spaced apart locations around the periphery of thecover. Each lug 46 includes a relatively short, tubular sleeve 48 thatis formed in one piece from the material of the lug, for example, bystamping. The sleeve 48 defines a central opening 50 in the lug.Corresponding to the three lugs 46 on the cover 26 are three lugs 52formed in one piece with and spaced apart around the periphery of thehousing 12. Each lug 52 includes a central opening 56 that receives thetubular sleeve 48 of a corresponding lug 46 of the cover 26.

To secure the electronic assembly 10 to the vehicle body (not shown), ametal fastener 54, such as a bolt, (FIG. 3) is inserted into the tubularsleeve 48 of each of the lugs 46 of the cover 26 for the electronicassembly. The metal fastener 54 extends through the tubular sleeve 48and projects from the end of the sleeve a distance sufficient to allowthe bolt to pass through a portion of the vehicle body (not shown). Asecond fastener element 55 (FIG. 3), such as a metal nut, is attached tothe end of the metal fastener 54 and tightened to secure the metalfastener to the vehicle body and thereby also provide a electricalground path from the metal cover 26 through the metal fastener to thevehicle body.

Each tubular sleeve 48 of the metal cover 26 has a length selected tolimit the compression load that may be applied to the corresponding lug52 of the plastic housing 12 by tightening the second fastener element55, such as a nut, on the metal fastener 54 when it extends through thesleeve. Specifically, each tubular sleeve 48 of the cover 26 may have alength greater than, equal to, or less than the thickness of thecorresponding lug 52 of the housing 12. If the length of tubular sleeve48 is less than the thickness of the corresponding lug 52 of the housing12, the difference between the length of the tubular sleeve and thethickness of the lug will help to determine the extent to which theplastic material of the lug may be compressed.

In accordance with an alternative example embodiment of the electronicassembly 10, the screws 30, the openings 32, and the threaded metalinserts 44 may be eliminated. In such an alternative embodiment, thedepressions 34 are still included. The depressions 34 surround theopenings 32 in the cover 26, as shown in FIG. 2, and are stamped in thecover and therefore appear as projections on the underside of the cover.The depressions or projections 34 contact the PCB 18 adjacent theopenings 36 in the PCB. Electrically-conductive contacts (not shown)extend through the openings 36 and engage the depressions or projections34 to provide a ground path from the PCB 18 to the cover 26. The metalcover 26 may be grounded to the vehicle body (not shown) through themetal fasteners 54. The metal fasteners 54, when secured to the vehiclebody, may also press the depressions or projections 34 against the PCB18 both to maintain the electrically-conductive ground path and to clampthe PCB against adjacent portions of the housing 12, such as the posts38.

As a further example embodiment of the present invention, the cover 26may be formed of a plastic material and then coated with a conductiveconformal coating. The conductive conformal coating provides a groundpath for the PCB 18, which may otherwise be provided by the metal cover26 of FIG. 1. Such a plastic cover 26 may be secured to the housing 12by a variety of techniques, such as laser welding.

FIG. 4A illustrates a method, in accordance with an example embodimentof the present invention, for assembling the header assembly 20. Asshown in FIG. 4A, a first row of compliant pins 24 is formed in aconfiguration in which adjacent pins are joined together, side-by-side,in two laterally spaced apart first “combs” 58. The compliant pins 24 ofthe two first combs 58, which may initially be manufactured as straightpins, are bent into L-shaped configurations and inserted into or“stitched into” the plastic header 22. Retention features 40 (FIG. 7C),such as barbs, on the compliant pins help maintain the pins securely inplace in the plastic header 22. A second row of compliant pins 24 isformed in a configuration in which adjacent pins are joined together,side-by-side, in two laterally spaced apart second “combs” 60. Thecompliant pins 24 of the two second combs 60, which may initially bemanufactured as straight pins, are bent into L-shaped configurations andinserted into the plastic header 22 underneath and behind the compliantpins 24 of the two first combs 58. The resulting header assembly 20includes two rows of compliant pins 24 with compliant pin legs 62projecting upward and terminal legs 64 projecting horizontally.

As shown in FIG. 4A, the header 22 of the header assembly 20 includesresiliently flexible arms 66 at opposite ends of the header. Eachflexible arm 66 is molded in one piece with the header 22 and has aproximal end joined to the header. The flexible arm 66 extends from itsproximal end generally parallel to an adjacent surface of the header 22but spaced from the header to an enlarged distal end 68. The enlargeddistal end 68 is formed with series of serrations or projections 70(FIGS. 5A and 6B) and enables the header 22 to be snapped into matingfeatures in the housing 12.

Although the header assembly 20 of FIG. 4A has its compliant pins 24arranged in two spaced-apart groups, each of which includes two rows ofpins, all of the pins may alternatively be arranged in a single group,as shown in the alternate construction of FIG. 4B, depending on theconfiguration of the external, mating connector (not shown). Also,although the compliant pins 24 of the header assembly 20 of FIG. 4A areformed and inserted into the header 22 in first and second combs 58 and60 of multiple compliant pins, the compliant pins may alternatively beinserted into the header individually, as shown in FIG. 4B. Further, theheader 22 may be formed with more openings to receive compliant pins 24than there are compliant pins to insert into the header. As stillfurther shown in FIG. 4B, the header 22 may include a groove 72 thatsurrounds the projecting terminal legs 64 of the compliant pins 24 andthat may receive a seal member 74, such as an O-ring.

As shown in FIG. 4A, the header 22 may include optional projectingshorting bars 76. The shorting bars 76 may be molded in one piece withthe header and may project from the front of the header in the samedirection as the terminal legs 64 of the compliant pins 24. The shortingbars 76 help to ensure that electrical connections are not inadvertentlyshorted across adjacent terminal legs 64 of the compliant pins 24 andmay also help protect the terminal legs from being inadvertently bent orotherwise deflected from their desired orientation.

As best shown in FIGS. 5A through 6B, the header assembly 20 is snappedin place inside the housing 12. The snap-in connection is achieved byengagement between the flexible arms 66 on the plastic header 22 andguide walls 78 projecting from the interior surface of the top 16 of thehousing 12. The flexible arms 66 and the guide walls 78 representinter-engaging features of the header assembly 20 and the housing,respectively.

In one example embodiment of an assembly process in accordance with thepresent invention, the header assembly 20 is placed in the housing 12spaced from the housing side walls 14 a -14 d. One housing side wall 14a is formed with two spaced apart openings 80 to receive the projectingterminal legs 64 of the compliant pins 24 and the projecting shortingbars 76. A connector shroud 82 surrounds both openings 80 and projectsoutwardly from the side wall 14 a of the housing 12. A step 84 formed inthe side wall 14 a surrounds both openings 80 and is presented inwardlyof the side wall toward the header assembly 20.

The header assembly 20 is oriented relative to the side wall 14 a sothat the projecting terminal legs 64 of the compliant pins 24 and theprojecting shorting bars 76 are aligned with the openings 80. The headerassembly 20 is then pressed in a direction toward the side wall 14 a ofthe housing 12, as indicated by the two arrows in FIG. 5A, until thefront of the header 22 engages and mates with the step 84 in the sidewall. As the header assembly 20 is being pressed toward the side wall 14a, the flexible arms 66 of the header 22 contact and are deflected bythe guide walls 78 of the housing 12. When the header 22 engages andmates with the step 84 in the side wall 14 a, the enlarged end 68 ofeach flexible arm 66 snaps into a recess 86 formed in the adjacent guidewall 78.

The serrations or projections 70 on the enlarged end 68 of each flexiblearm 66 are arranged at angle relative to the length of the flexible arm.Consequently, the extent to which each flexible arm 66 enters the recess86 of the corresponding guide wall 78 is determined by the distancebetween the enlarged end 68 of the flexible arm and the front surface ofthe header 22 that engages the step 84 in the side wall 14 a. Theflexible arms 66 may thereby both adapt to differences in the foregoingdistance that result from variations in the dimensions of the header 22and housing 12 within manufacturing tolerances and also provide anongoing outward bias on the header 22 to help ensure a tight fit betweenthe header and the side wall 14 a of the housing. The outward biasprovided by the flexible arms 66 may also oppose a force applied when anexternal connector (not shown) is pressed against the compliant pins 24to attach the electronic assembly 10 to other vehicle circuitry (notshown).

To help ensure proper alignment between the compliant pins 24 of theheader assembly 20 and the mating connector features of an externalconnector (not shown) that may connect the electronic assembly 10 toother vehicle circuitry (not shown), various datum surfaces may beprovided on the housing 12, the header 22, and the compliant pins.Specifically, multiple parallel raised ribs 90 may be formed on theinterior surface of the top 16 of the housing 12 to support asubstantially flat bottom surface 88 (FIG. 6A) of the header 22.Substantially flat upper surfaces 92 of the raised ribs 90 may beprecisely located relative to substantially flat surfaces 94 that definelower edges of the openings 80. The precise spacing between thesubstantially flat upper surfaces 92 of the raised ribs 90 and thesubstantially flat surfaces 94 in the side wall 14 a of the housing 12may help to ensure that the header 22 is precisely located relative tothe housing in the vertical direction, as viewed in FIG. 5B. The precisespacing between the substantially flat upper surfaces 92 of the raisedribs 90 and other datum surfaces of the housing 12 may be achieved byhaving the portion of the plastic molding tool used to form the raisedribs 90 interface or engage directly with the portion of the plasticmolding tool used to form the connector shroud 82.

To help locate the header 22 relative to the housing 12 in thehorizontal direction, as viewed in FIG. 5B, a slot 96 may be preciselylocated in at least one of the substantially flat surfaces 94 in theside wall 14 a of the housing to receive a corresponding, preciselylocated rib 98 formed in the header. A similar, precisely located slot100 may be formed in one or both of two substantially flat uppersurfaces 102 that partially define the openings 80 in the side wall 14 aof the housing 12 to receive a similar, precisely located rib 104 in theheader 22.

To help locate the compliant pins 24 precisely relative to the housing12 and the opening 80 in the housing, a substantially flat passage datumsurface 106 may be formed at the bottom (as viewed in FIG. 7A) of eachpin-receiving passage 108 in the header 22. The substantially flatpassage datum surface 106 may be precisely located relative to thesubstantially flat bottom surface 88 of the header 22. A correspondingsubstantially flat pin surface 110 may be formed on each compliant pin24. When the compliant pins 24 are inserted into the passages 108, thesubstantially flat pin surfaces 110 are disposed immediately adjacentand overlying (as viewed in FIGS. 7A and 7B) the substantially flatpassage datum surfaces 106.

To help ensure full engagement between the substantially flat pinsurfaces 110 and the substantially flat passage datum surfaces 106,surfaces 112 of the compliant pins 24 that are opposed to thesubstantially flat pin surfaces 110 may be formed with raised portions114. The raised portions 114 of the opposed surfaces 112 of the pins 24engage passage surfaces 116 that are located opposite the substantiallyflat passage datum surfaces 106. Because the compliant pins 24 are madefrom resilient metal material, the raised portions 114 exert a downwardbias on the compliant pins and press the substantially flat pin surfaces110 against the substantially flat passage datum surfaces 106. Thecompliant pins 24 may thereby be precisely located relative to thesubstantially flat bottom surface 88 of the header 22, which may, inturn, be precisely located relative to the housing 12.

To help position the compliant pins 24 laterally in the pin receivingpassages 108 of the header 22, each pin receiving passage and eachcompliant pin may have a laterally tapered configuration. Moreparticularly, as shown in FIG. 7C, opposed passage side surfaces 115 ofthe header 22, which partially define the pin receiving passages 108,may be disposed at first angle relative to one another. Correspondingopposed side surfaces 117 of the compliant pins 24 may similarly bedisposed at a second angle relative to one another. The second angle maybe smaller than the first angle, the same as the first angle, or largerthan the first angle. As a result, when the opposed side surfaces 117 ofa compliant pin 24 engage the opposed passage side surfaces 115 thatdefine a corresponding pin receiving passage 108 during insertion of thecompliant pin in the pin receiving passage, the compliant pin will tendto be centered laterally in the pin receiving passage.

After the header assembly 20 is connected to the housing 12, the PCB 18is positioned over the compliant pin legs 62 of the compliant pins 24,as shown in FIG. 1. The upwardly projecting compliant pin legs 62 of thecompliant pins 24 extend into corresponding mating holes 118 in the PCB18. The compliant pin legs 62 of the compliant pins 24 engage PCBsurfaces that define the holes 118 and that may be plated or otherwiseprovided with electrically conductive material to provide an electricalconnection between the compliant pins and the PCB 18. The cover 26 maythen be placed over the open bottom of the housing 12 and secured inplace using the metal screws 30.

As shown in FIGS. 1 and 8A, the interior of the housing 12 may be formedwith support ribs 120 and guide ribs 122 that extend vertically alongthe sides of the housing and that are molded in one piece with thehousing. The upper ends (as viewed in FIGS. 8A and 8B) of the supportribs 120 and guide ribs 122 are located adjacent the open bottom of thehousing 12, while the lower ends of the support ribs and guide ribs areclosely spaced to or merge into horizontal projections 123. Theprojections 123 may be formed as substantially horizontal lips orhorizontally extending flanges molded in one piece with the housing 12and provide flat support surfaces 124 adjacent the cover 26 for thehousing. The flat support surfaces 124 support the PCB 18. The supportsurfaces 124 may also provide probing surfaces that are used asdescribed in greater detail below. The upper ends of both the supportribs 120 and the guide ribs 122 may optionally include tapered gussetsor angled surfaces 126 to help guide the PCB 18 into place on thesupport surfaces 124. The guide ribs 122 may also act as lateral crushribs to accommodate manufacturing tolerances in the PCB 18 and thehousing 12 while still maintaining the PCB tightly in place.

The PCB 18 may be formed with one or more holes 127, as shown in FIG.8B, to permit a mechanical check to ensure that the PCB is properlyseated on the support surfaces 124 formed on the support ribs 120. Thecheck can be performed during the assembly process by having a probe(not shown) automatically inserted into each hole 127 to check thedistance between the top of the PCB 18 and the top of the underlyingsupport surface 124.

As shown in FIG. 5B, the header 22 used in the compliant pin headerassembly 20 may be formed with an optional hole 128 for leak testing.The hole 128 may have precise dimensions to provide a predetermined flowarea. The predetermined flow area may be used to assess whether thecompleted electronic assembly 10 is properly sealed by applying a vacuumto the electronic assembly and measuring how long it takes to exhaustthe air from the electronic assembly.

FIGS. 9A and 9B illustrate an optional capacitor carrier 130 for theelectronic assembly 10. More specifically, as shown in FIG. 9A, thecapacitor carrier 130 may be mounted to the top 16 of the housing 12 sothat the capacitor carrier is located adjacent to the PCB 18 on a sideof the PCB opposite the cover 26 or underneath the PCB (as viewed inFIG. 1). The capacitor carrier 130 has a tubular configuration and maybe made of a plastic material. An elongated cylindrical capacitor 132may be received in the capacitor carrier 130 through an open end of thecapacitor carrier. Longitudinally extending ribs (not shown) may beformed on the interior surface of the capacitor carrier 130 to supportthe capacitor 132 in spaced relationship to a major portion of theinterior surface of the capacitor carrier.

Terminals 134 may extend axially from an end of the capacitor 132 andengage adjacent ends of electrically conductive pins 136 pressed intoopenings (not shown) formed in an end portion 138 of the capacitorcarrier 130. Compliant ends 140 of the conductive pins 136 project fromthe end portion 138 of the capacitor carrier 130 for engagement with thePCB 18, as will be described in further detail below. Two resilientplastic spring fingers 142 may be formed in one piece with the capacitorcarrier 130 to apply a spring bias to the capacitor 132 to help hold itin place in the capacitor carrier. Although two spring fingers 142 areshown in FIG. 8C, any number of spring fingers may be used. The springfingers 142 facilitate using the capacitor carrier 130 to supportcapacitors 132 of various lengths.

Support legs 144 may be disposed about the capacitor carrier 130 and maybe molded in one piece with the capacitor carrier to help mount thecapacitor carrier to the PCB 18. Each support leg 144 may receive amounting pin 146 similar in construction to the electrically conductivepins 136, although the mounting pins need not be electricallyconductive. Each mounting pin 146 has an enlarged end 148 and acompliant end 150 and generally tapers in width from the enlarged end tothe compliant end. When each mounting pin 146 is inserted into anopening (not shown) in a support leg 144, the tapered shape of themounting pin effectively causes the mounting pin to be wedged in placein the support leg with the compliant end 150 projecting from thesupport leg, as shown in FIG. 9A. The compliant ends 150 of the mountingpins 146 and the compliant ends 140 of the conductive pins 136 may bereceived in openings 152 in the PCB 18. The compliant ends 140 of theconductive pins may engage electrically conductive features (not shown)on the PCB 18, while the compliant ends 150 of the mounting pins 146 mayengage non-conductive portions of the PCB to help hold the capacitorcarrier 130 and the capacitor 132 in place.

Referring to FIG. 10, a manufacturing method 300 in accordance with anexample embodiment of the present invention is shown. The examplemanufacturing method 300 may be used to manufacture a plurality ofdifferent electronic assemblies, such as the electronic assembly 10illustrated in FIGS. 1-3 and described above, and also an electronicassembly 210.

The electronic assembly 10 includes a housing 12, a compliant pin headerassembly 20 formed of a header 22 and compliant pins 24, a PCB 18, acover 26, and screws 30, all as described in detail above. Theelectronic assembly 210 similarly includes a housing 212, a compliantpin header assembly 220 formed of a header 222 and compliant pins 224, aPCB 218, a cover 226, and screws 230, which are similar to but differentthan the corresponding components of the electronic assembly 10. Forexample, the header assembly 20 of the electronic assembly 10 includestwo rows of compliant pins 24, which are arranged in two spaced apartgroups in each row. In contrast, the header assembly 220 of theelectronic assembly 210 may include three rows of compliant pins 224arranged without gaps or groups of compliant pins in each row and thushas at least one header assembly characteristic that is different fromthe corresponding characteristic of the header assembly 20. As anadditional example, the housing 12 of the electronic assembly 10 has aconnector shroud 82 with a divider 83 that divides the space surroundedby the connector shroud into two portions corresponding to the twogroups of compliant pins 24. The housing 12 also includes threeoutwardly projecting lugs 52. The housing 212 of the electronic assembly210, on the other hand, may have a connector shroud 282 without anydivider so that the space surrounded by the connector shroud is onecontinuous space. The housing 212 may also include two outwardlyprojecting lugs 252 and a hook 253. The housing 212 thus has housingcharacteristics that are different from the correspondingcharacteristics of the housing 12. As yet a further example, the PCB 18has one configuration of holes 118 to receive the compliant pin legs 62of the compliant pins 24, while the PCB 218 may have a differentconfiguration of holes to receive the compliant pin legs of thecompliant pins 224. The PCB 218 thus has at least one PCB characteristicthat is different from the corresponding characteristic of the PCB 18.

The manufacturing method 300 uses common materials and common equipmentto manufacture both the electronic assembly 10 and the electronicassembly 210. In particular, the manufacturing method 300 may begin witha common electrically conductive pin material 310, such as a metal, fromwhich to manufacture both the compliant pins 24 and the compliant pins224. The manufacturing method 300 may also include a common plasticheader material 312 from which to form the plastic headers 22 and 222.After the compliant pins 24 and 224 and the headers 22 and 222 have beenformed, a common pin insertion machine 314 may be used to insert thecompliant pins 24 into the plastic header 22 and to insert the compliantpins 224 into the plastic header 222. The common pin insertion machine314 may require one set of tooling (not shown) to grasp the compliantpins 24 and a second set of tooling (not shown) to grasp the compliantpins 224, but the common pin insertion machine 314 may nonetheless beused to insert the compliant pins 24 and 224 into their correspondingheaders 22 and 222, respectively. Thus, only a single pin insertionmachine 314 may need be purchased and used to produce both the headerassembly 20 and the header assembly 220. The common pin insertionmachine 314 may thus be used to produce large quantities of compliantpin header assemblies 20 and compliant pin header assemblies 220 withdifferent sizes of headers 22 and 222 and different numbers of compliantpins 24 and 224, thereby helping to reduce overall capital equipmentinvestment cost and individual part costs.

Similarly, the manufacturing method 300 may include a common plastichousing material 316 from which to form the plastic housings 12 and 212.The manufacturing method may also include a common insert material (notshown) from which to form metal inserts, such as inserts 44, for theplastic housings 12 and 212. The manufacturing method may use a commoninsert pressing machine (not shown) to heat the metal inserts and pressthem into the housings 12 and 212 and a common header assembly insertionmachine 318 to insert the header assemblies 20 and 220 into the plastichousings 12 and 212, respectively. The common header assembly insertionmachine 318 may require one set of tooling (not shown) to grasp theheader assembly 20 and a second set of tooling (not shown) to grasp theheader assembly 220, but the common header assembly insertion machinemay nonetheless be used to insert both header assemblies 20 and 220 intothe respective plastic housings 12 and 212. Thus, only a single headerassembly insertion machine 318 may need be purchased and used to insertboth the header assembly 20 and the header assembly 220.

The manufacturing method 300 may also include a common PCB material 319from which to form the PCBs 18 and 218. The manufacturing method 300 mayuse a common board-to-housing assembly machine 320 to mount the PCBs 18and 218 on the compliant pins 24 and 224 of the header assemblies 20 and220, respectively. The common board-to-housing assembly machine 320 mayrequire one set of tooling (not shown) to grasp the PCB 18 and positionthe PCB 18 relative to the compliant pins 24 and a second set of tooling(not shown) to grasp the PCB 218 and position the PCB 218 relative tothe compliant pins 224, but the common board-to-housing assembly machine318 may nonetheless be used to mount both PCBs 18 and 218. Thus, only asingle board-to-housing assembly machine 320 may need be purchased andused to mount both PCBs 18 and 218 on the compliant pins 24 and 224 ofthe header assemblies 20 and 220, respectively.

The manufacturing method 300 may further use a common electricallyconductive cover material 322, such as a metal, from which tomanufacture both the cover 26 and the cover 226. After the covers 26 and226 are fabricated from the common cover material 322, the manufacturingmethod may further use a common screw insertion and tightening machine324 to insert the screws 30 and 230 into the corresponding covers 26 and226, respectively, and tighten the screws 30 and 230 in thecorresponding threaded metal inserts 44 and 244. The common screwinsertion and tightening machine 324 may require one set of tooling (notshown) to position the screws 30 relative to the cover 26 and a secondset of tooling (not shown) to position the screws 230 relative to thecover 226, but the common screw insertion and tightening machine 324 maynonetheless be used to insert both sets of screws 30 and 230 into thecovers 26 and 226, respectively. Thus, only a single screw insertion andtightening machine 324 may need to be purchased and used to insert bothsets of screws 30 and 230.

From the above description of the invention, those skilled in the artwill perceive improvements, changes and modifications. Suchimprovements, changes and modifications within the skill of the art areintended to be covered by the appended claims.

1-33. (canceled)
 34. A method of manufacturing an electronic device,said method comprising the steps of: molding a header from a plasticheader material to form passages in the header to receive a plurality ofcompliant pins, each passage of the header being at least partiallydefined by a substantially flat datum surface and an opposed passagesurface disposed opposite the substantially flat datum surface; formingeach of the compliant pins from electrically conductive material to havea substantially flat pin surface and an opposed pin surface disposedopposite the substantially flat pin surface, the opposed pin surfaceincluding a raised portion; inserting each compliant pin into acorresponding passage of the header to form a compliant pin headerassembly, the raised portion of the opposed pin surface of the compliantpin engaging the opposed passage surface of the corresponding passageand thereby pressing the substantially flat pin surface of the compliantpin against the datum surface of the corresponding passage; engaging thecompliant pin header assembly with a housing so that a first end of eachcompliant pin is presented outwardly of the housing and a second end ofeach compliant pin is disposed within the housing; and placing a printedcircuit board within the housing so that the printed circuit boardengages the second end of each compliant pin.
 35. The method of claim 34further comprising the step of molding the housing from a plastichousing material.
 36. The method of claim 34 further comprising the stepof forming a cover for the electronic device from a metal covermaterial.
 37. The method of claim 36 further comprising the step ofassembling the cover to the housing so that the cover engages anelectrical contact formed on the printed circuit board at a locationspaced from an outer peripheral area of the printed circuit board toprovide an electrical grounding path from the printed circuit board tothe cover. 38-43. (canceled)